China PCB Manufacturing and Assembly House with High Capablities
Winow PCB Advanced Special Capability
| item | capability |
| Layers | 1-30 |
| Thicker Copper | 1-6OZ |
| Products Type | HF(High-Frequency)&(Radio Frequency) board, Impedance controlled board , HDI board ,BGA& Fine Pitch board |
| Solder Mask | Nanya&Taiyo ;LPI & Matt Red, green, yellow,white, blue,black. |
| Base material | FR4(Shengyi China、ITEQ, KB A+,HZ), HI-TG, FR06, Rogers,Taconic、Argon and so on |
| Finished Surface | Conventional HASL,Lead-free HASL,Falsh Gold, ENIG (Immersion Gold)OSP(Entek), Immersion Tin,ImmersionSilver,Hard Gold |
| Selective Surface Treatment |
ENIG(immersion Gold)+OSP, ENIG(immersion Gold)+Gold Finger,Flash Gold +Gold Finger, immersion Silver+ Gold Finger, Immersion Tin+Gold Finger |
| Technical Specification | Minimum line width/gap:3.5/4mil(laser drill) Minimum hole size:0.15mm(mechanical drill)/4mil(laser drill) Minimum Annular Ring: 4mil Max Copper thickness: 6OZ Max Production size:900×1200mm Board Thickness:D/S: 0.2-7.0mm, Multilayers:0.40-7.0mm, Min Solder Mask Bridge:0.08mm Aspect ratio: 15:1 Plugging Visa capability: 0.2-0.8mm |
| Tolerance | Plated holes Tolerance:0.08mm(min±0.05) Non-plated hole tolerance:0.05min(min+0/-0.05mm or +0.05/-0mm) Outline Tolerance:0.15min(min±0.10mm) Functional test : Insulating resistance : 50 ohms (mormality) Peel off strength: 1.4N/mm Thermal Stress test :2650c,20 seconds Solder mask hardness:6H E-Test voltage :500V+15/-0V 30S Warp and Twist: 0.7% (semiconductor test board≤0.3% ) |
|
Item |
Brand/Specifications |
Remark |
|||
|
Material |
FR-4 |
Normal TG |
Shengyi、Tenghui(Taiwan Brand) |
||
|
Medium TG |
Shengyi、Tenghui(Taiwan Brand) |
||||
|
High TG |
Shengyi、Tenghui(Taiwan Brand) |
||||
|
HF |
Medium TG |
Shengyi |
|||
|
High TG |
Shengyi |
||||
|
Ceramic filled high frequency board |
Rogers4003/4350、Arlon25N/25FR |
||||
|
PTFE high frequency board |
Rogers series、Arlon series、 Taconic series、TaiZhou Wangling |
||||
|
Special PP |
Rogers4450、Arlon25FR、Arlon 49N、 Arlon6700、Taconic FR-27 |
||||
|
Rigid PI |
Arlon85N、Shengyi SH260 |
||||
|
Metal PCB |
Bergquist Alu. Domestic Alu,Copper base board |
||||
|
Layers |
FR-4 |
40-layer |
|||
|
HDI |
24-layer |
||||
|
Rigid-Flexible |
16-layer |
||||
|
High-frequency Multilayer |
24 -layer |
||||
|
PTFE |
12-layer |
||||
|
Metal Sandwich Board |
4-layer |
||||
|
Trace width/space |
Inner Layer |
3mil／3mil（0.5OZ base copper ） |
|||
|
4mil／4mil（1OZ base copper） |
|||||
|
5mil／6mil（2OZ base copper） |
|||||
|
7mil／8mil（3OZ base copper） |
|||||
|
8mil／10mil（4OZ base copper） |
|||||
|
Outer Layer |
3mil／3mil（1/3OZ base copper、0.5OZ base copper） |
||||
|
5mil／5mil（1OZ base copper） |
|||||
|
6mil／7mil（2OZ base copper） |
|||||
|
7mil／8mil（3OZ base copper） |
|||||
|
8mil／10mil（4OZ base copper） |
|||||
|
Item |
Specifications |
Remark |
||
|
Drill |
Min. merchanical drilling size |
0.15mm |
||
|
Min.laser blind drilling size |
0.10mm |
|||
|
Ratio of thickness to via size |
12:1 |
|||
|
Min. annular ring |
3mil |
|||
|
Min. annular ring for component hole |
6mil |
|||
|
Min.via space(same network) |
0.20mm |
|||
|
Min. via space(different network) |
0.35mm |
consider aboutCAF |
||
|
Min. space for component holes |
0.70mm |
|||
|
Inner vias to copper distance |
7mil |
|||
|
Min. half hole |
0.4mm |
|||
|
Via in pad or resin plugged via diameter |
0.10-0.6mm |
|||
|
Tolerance |
Via diameter tolerance |
±3mil(PTH) |
||
|
±2mil(NPTH) |
||||
|
±2mil(pressfit hole) |
||||
|
Dimension tolerance |
±0.10mm |
|||
|
Slot size tolerance |
±0.10mm |
|||
|
Impedance control value tolerance |
±8％ |
|||
|
Board thickness tolerance |
±8％（board thickness＞1.0mm) |
|||
|
±0.10mm(board thickness≤1.0mm) |
||||
|
Deep drilling via tolerance |
±0.10mm |
|||
|
Trace width tolerance |
±2mil（trace width＞10mil) |
|||
|
±20%( trace width≤10mil) |
||||
|
Item |
Specifications |
Remark |
|||
|
Surface finish |
Immersion gold |
Max. gold thickness |
8u" |
||
|
Hard gold |
Max. gold thickness |
2.0um |
|||
|
Immersion tin |
Tin thickness |
0.8-1.2um |
|||
|
Immersion silver |
Silver thickness |
0.15-0.25um |
|||
|
OSP |
Film thickness |
0.2-0.5um |
|||
|
Hasl with lead/Hasl lead free |
Tin thickness |
2-40um |
|||
|
Board thickness |
0.6mm≤H≤3.0mm |
||||
|
Others |
Bow and twist |
0.5% |
|||
|
Soldermask bridge |
IC space(green oil) |
7mil |
|||
|
IC space(oil with other color) |
8mil |
||||
|
Copper thickness |
Inner layer |
12OZ |
|||
|
Outer layer |
15OZ |
||||
|
Drilling times for mechanical blind vias |
≤3 times |
||||
|
Board thickness |
Max. thickness |
6.8mm |
|||
|
Min. thickness |
0.2mm（double-sided） |
||||
One Stop PCB assembly Sevice ALLPCB SMT Capability
|
It will be a great pleasure to receive your inquiries for any of PCBA service against which we can offer competitive price with high quality&fast delivery. |
||
|
ALLPCB Assembly Capability |
||
|
Flexible assembly service |
||
|
PCB fabricating flexility |
We are able to fabricate 1-16 layers PCB, if your PCB technology is beyond our manufacture capacity, it will be outsourced to our partner stability factory with high quality. |
|
|
part supply flexility |
Turn-key |
We source all components for you from authorized components supplier or distributors. |
|
Partial Turn-key |
Customer offer partial of components as they prefer and we will source the rest as required. |
|
|
Consigned |
Components can be supplied by the customer,we accept parts in Reels, Cut Tape, Tube & Tray, Loose Parts and Bulk |
|
|
assembly flexility |
assemble type |
SMT,THT &Hybrid, single or double side placement. |
|
Stencils |
Offer Laser-cut stainless steel stencil. |
|
|
Solder type |
Offer both lead&lead-free (RoHS Compliant) assembly services. |
|
|
board type |
Rigid board, flex board&rigid-flex board. |
|
|
PCB or Panel Size |
Min board size of 10*10mm, will be panelized to suit the SMT machine |
|
|
board shape |
No restrictions for rectangular, Circular and any Odd Shapes, will adjust the panelize for better placement. |
|
|
components |
Passive components as small as 01005, 0201,0402 |
|
|
Volume flexility |
prototype |
MOQ as low to 5units in 1-2 days delivery |
|
low volume |
Offer 3-4 days quick turn time service for low volume. |
|
|
high volumn |
Offer accurate delivery to catch your deadline. |
|
|
Comprehensive Quality Assurance |
||
|
production facilities certification |
ISO9001 certified |
|
|
Inspection |
IPC610－D Test specification |
|
|
Pass rate |
≥99.5% |
|
|
Quality complaint rate |
≤ 0.1% |
|
|
Repair & Rework |
BGA reballing service acceptable |
|
|
Advance Testing equipment |
||
|
Visual inspection |
General quality check |
|
|
AOI Testing |
Checks for solder paste, 0201 components, missing components,polarity |
|
|
X-ray Inspection |
Checks for BGAs, QFN and bare circuit boards |
|
|
KIC temperature test |
Furnace temperature controlled within ±0.1℃ |
|
|
ICT Testing |
In-Circuit Test |
|
|
Functional test |
Function test as customized |
|
Sales Network
