China PCB Manufacturing, HDI, FPC, Rigid-flex PCB, Aluminum base PCB, metal core PCB, PCB Fabrication

PCB Fabrication

pcb fabrication with high quality

Winow New Energy Co., Limited offers Printed Circuit Board manufacturing with high quality and affordable price. No matter single board for a prototype or large volume production, Winow technology can meet your requirements of PCB fabrication in a variety of materials and technologies. We focus on multi-layer printed circuit boards, impedance Controlled circuit boards and HDI PCB, Aluminum based PCB, Rigid-Flex PCB in diverse complexities.

Circuit Board Specifications

  • Maximum Panel size: 600×770mm (23.62"×30.31")
  • Maximum Number of Layers: 1-36
  • Copper Thickness: 0.5 oz to 20.0 oz
  • Minimum Line Width: 3 mil
  • Minimum Line spacing: 3 mil
  • Smallest Hole: 0.006"
  • Blind, Buried and plugged Vias
  • Controlled impedance

PCB Fabrication Product Show

Aluminum Base PCB

Technical Parameters

  • Layer count: 1
  • Board thickness: 1.0mm
  • Raw material: Aluminum base+FR4, thermal conductivity 2.0w/mk
  • Copper thickness on the board surface: ≥45um
  • Copper thickness in the hole barrel: 20um
  • Min. line width/space: 0.25mm
  • Minimum hole diameter: 0.3mm
  • Surface finishing: immersion gold ≥1u"
  • Application: illumination
Aluminum PCB Supplier

Flex PCB

Technical Parameters

  • Layer count: 2
  • Board thickness: 0.14mm
  • Dimension: 88×58.68mm
  • Raw material: double sided, RD copper without AD
  • Copper thickness on the board surface: 20um
  • Copper thickness in the hole barrel: 9um
  • Min. line width/space: 0.075mm
  • Minimum hole diameter: 0.2mm
  • Surface finishing: immersion gold ≥1u"
  • Application: GPS
Flex PCB Product

Rigid-Flex PCB

Technical Parameters

  • Layer count: 8
  • Board thickness: 1.5mm
  • Dimension: 98×88.1mm
  • Raw material: FR4+PI+NFPP
  • Copper thickness on the board surface: ≥35um
  • Copper thickness in the hole barrel: 20um
  • Min. line width/space: 0.075mm
  • Minimum hole diameter: 0.2mm
  • Surface finishing: immersion gold ≥2u"
  • Application: high frequency antenna
Rigid-Flex PCB Product

HDI PCB

Technical Parameters

  • Layer count: 2 stage 10 layer
  • Board thickness: 1.0mm
  • Dimension: 158×120.89mm
  • Raw material: FR4 EM825
  • Copper thickness on the board surface: ≥35um
  • Copper thickness in the hole barrel: 20um
  • Min. line width/space: 0.075mm
  • Minimum hole diameter: 0.1mm
  • Surface finishing: immersion gold ≥1u"
  • Application: automotive driving recorder
HDI PCB Product