China Aluminum base PCB Manufacturing,metal core pcb,quick turn pcb,HDI

 Aluminum PCB

                                       aluminum pcb


Aluminum PCB /Metal Core PCB / MCPCB (Enquiry pls send to e-mail : This e-mail address is being protected from spambots. You need JavaScript enabled to view it )

 Among all Metal core PCBs ( MCPCBs, known for their ability to provide effective thermal dissipation for electronic products), Aluminum PCBs is the most common type - the base material consists of aluminum core with standard FR4. It features a thermal clad layer that dissipates heat in a highly efficient manner, while cooling components and increasing the overall performance of the products. Currently, Aluminum Backed PCBs is regarded as the solution to high power and tight tolerance applications.

 Our full feature aluminum circuit boards making capabilities and value-added options including Free DFM Check allow you to get high-quality aluminum PCBs done within budget. Aluminum PCBs printed by us are widely used for LED lighting, power equipment and automotive systems.

aluminum pcb supplier


Metal Core PCB Materials and Thickness

 The metal core of the thermal PCB can be aluminum (aluminum core PCB), copper (copper core PCB or a heavy copper PCB) or a mixture of special alloys. The most common is an aluminum core PCB.

 The thickness of metal cores in PCB base plates is typically 30 mil - 125 mil, but thicker and thinner plates are possible.

 MCPCB copper foil thickness can be 1 - 10 oz.


Winow Aluminum PCB Capacity :

 Winow can produce 1Layer, 2Layer ,4 Layer and 6layer Aluminum PCB . Multilayer aluminum PCB is mainly used by high power industria products ,Like outdoor Led screen .

 Solder mask color : White , Black , We can provide super white color for LED PCB to improve the Led lumen.

 The following table presents some of our Aluminum Core materials:

Items Performance Index (Measured value)
Peeling strength (n/mm) 1.8
Insulation resistance (ω) >1*10 g
Breakdown voltage (vdc) >2 k
Soakable soldering (°C/m) 280°C / 260°C, 1 min, no bubble & delamination
Thermal conductivity (ω/m-k) >0.8
Thermal resistance (°C/ω) < 1.2
Combustibility fv-o
Dielectric constant (1mhz) 4
Dielectric loss angle (tangent) 0.03