| item | capability |
| Layers | 1-30 |
| Thicker Copper | 1-6OZ |
| Products Type | HF(High-Frequency)&(Radio Frequency) board, Impedance controlled board , HDI board ,BGA& Fine Pitch board |
| Solder Mask | Nanya&Taiyo ;LPI & Matt Red, green, yellow,white, blue,black. |
| Base material | FR4(Shengyi China、ITEQ, KB A+,HZ), HI-TG, FR06, Rogers,Taconic、Argon and so on |
| Finished Surface | Conventional HASL,Lead-free HASL,Falsh Gold, ENIG (Immersion Gold)OSP(Entek), Immersion Tin,ImmersionSilver,Hard Gold |
| Selective Surface Treatment |
ENIG(immersion Gold)+OSP, ENIG(immersion Gold)+Gold Finger,Flash Gold +Gold Finger, immersion Silver+ Gold Finger, Immersion Tin+Gold Finger |
| Technical Specification | Minimum line width/gap:3.5/4mil(laser drill) Minimum hole size:0.15mm(mechanical drill)/4mil(laser drill) Minimum Annular Ring: 4mil Max Copper thickness: 6OZ Max Production size:900×1200mm Board Thickness:D/S: 0.2-7.0mm, Multilayers:0.40-7.0mm, Min Solder Mask Bridge:0.08mm Aspect ratio: 15:1 Plugging Visa capability: 0.2-0.8mm |
| Tolerance | Plated holes Tolerance:0.08mm(min±0.05) Non-plated hole tolerance:0.05min(min+0/-0.05mm or +0.05/-0mm) Outline Tolerance:0.15min(min±0.10mm) Functional test : Insulating resistance : 50 ohms (mormality) Peel off strength: 1.4N/mm Thermal Stress test :2650c,20 seconds Solder mask hardness:6H E-Test voltage :500V+15/-0V 30S Warp and Twist: 0.7% (semiconductor test board≤0.3% ) |
One Stop PCB assembly Sevice Winow SMT Capability
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It will be a great pleasure to receive your inquiries for any of PCBA service against which we can offer competitive price with high quality&fast delivery. |
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Winow Assembly Capability |
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Flexible assembly service |
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PCB fabricating flexility |
We are able to fabricate 1-16 layers PCB, if your PCB technology is beyond our manufacture capacity, it will be outsourced to our partner stability factory with high quality. |
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part supply flexility |
Turn-key |
We source all components for you from authorized components supplier or distributors. |
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Partial Turn-key |
Customer offer partial of components as they prefer and we will source the rest as required. |
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Consigned |
Components can be supplied by the customer,we accept parts in Reels, Cut Tape, Tube & Tray, Loose Parts and Bulk |
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assembly flexility |
assemble type |
SMT,THT &Hybrid, single or double side placement. |
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Stencils |
Offer Laser-cut stainless steel stencil. |
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Solder type |
Offer both lead&lead-free (RoHS Compliant) assembly services. |
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board type |
Rigid board, flex board&rigid-flex board. |
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PCB or Panel Size |
Min board size of 10*10mm, will be panelized to suit the SMT machine |
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board shape |
No restrictions for rectangular, Circular and any Odd Shapes, will adjust the panelize for better placement. |
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components |
Passive components as small as 01005, 0201,0402 |
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Volume flexility |
prototype |
MOQ as low to 5units in 1-2 days delivery |
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low volume |
Offer 3-4 days quick turn time service for low volume. |
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high volumn |
Offer accurate delivery to catch your deadline. |
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Comprehensive Quality Assurance |
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production facilities certification |
ISO9001 certified |
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Inspection |
IPC610－D Test specification |
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Pass rate |
≥99.5% |
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Quality complaint rate |
≤ 0.1% |
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Repair & Rework |
BGA reballing service acceptable |
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Advance Testing equipment |
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Visual inspection |
General quality check |
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AOI Testing |
Checks for solder paste, 0201 components, missing components,polarity |
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X-ray Inspection |
Checks for BGAs, QFN and bare circuit boards |
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KIC temperature test |
Furnace temperature controlled within ±0.1℃ |
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ICT Testing |
In-Circuit Test |
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Functional test |
Function test as customized |
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