Status of various circuit boards
Status of various circuit boards
In 2000, us PCB value accounted for about 26% of global output, Europe accounted for 16%, Japan accounted for 28%, and these three regions accounted for 70% : in 2017, us PCB value accounted for about 5%, Europe accounted for 3%, Japan accounted for 9%, and these three regions accounted for 17%.
Over the past two decades, the global PCB industry constantly to Taiwan, mainland China, the two regions of total output value accounted for from 19% in 2000 to 65% in 2017 to build a factory in China (foreign factory output calculation in the mainland of China) in the output of the whole, the mainland domestic manufacturers of output value proportion also from less than 5% in 2000 to more than 20% in 2017.
In terms of total output, China and Taiwan are already the largest PCB production bases in the world. However, in terms of structure, China mainly undertakes the low-end output value, and the high-end output value is still significantly lower than that of foreign enterprises.
The output value of multi-layer PCB is about 48% in Japan, Japan, Europe and South Korea and other regions outside Taiwan, 31% in China and 21% in China. China's leading manufacturers in the multi-layer board field include: shennan, hudian, yidong, shenghong, jingwang, chongda,sayfu multilayer etc. These manufacturers have successfully entered the core supply chain of dell, HP, huawei, etc. Both technology and capacity are catching up with foreign capital and Taiwan factories.
The output value of FPC and rigid-flex combination board accounts for about 63% of the total output value of the FPC and the output value of the FPC board. The proportion of the output value of the FPC board is about 63% in the United States, Japan, Europe and South Korea and other regions outside Taiwan. The proportion of the output value of the FPC board is 22% in Taiwan and 15% in China.
The output value of packing plate is about 60% in Japan, Europe, America, South Korea and other regions outside Taiwan, 38% in China and 2% in China. Packing board is one of the PCB varieties with the highest technical content at present. Japanese, Korean and some Taiwanese manufacturers occupy the technical high point.
In terms of output value of HDI, Japan, the United States, the United States and the republic of Korea and other regions outside Taiwan account for about 53 percent, China's Taiwan accounts for 38 percent and China accounts for 9 percent. Among them, zhending, aotes, TTM, xinxing and huatong are among the leading manufacturers, mainly supplying high-end smartphones. Among the mainland manufacturers, ultrasound electronics, founder technology, yilianda (owned by jiantao) also have the ability to produce HDI products, but have not been able to enter the high-end smartphone supply chain.
